IPC WP-006
Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003
Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
standard by Association Connecting Electronics Industries, 07/01/2003
Solderability Tests for Printed Boards with Amendment 1&2
standard by Association Connecting Electronics Industries, 09/01/2017
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987
The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002
Handbook / Manual / Guide by Association Connecting Electronics Industries, 07/01/1996
Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016
Drilling Guidelines for Printed Boards
standard by Association Connecting Electronics Industries, 03/01/2007
Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
standard by Association Connecting Electronics Industries, 07/01/2016
Automated Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/1988
Space Applications Electronic Hardware Addendum to J-STD-001F
Amendment by Association Connecting Electronics Industries, 2015
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017