IPC J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 01/01/2006
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 01/01/2006
Space Applications Electronic Hardware Addendum to Requirements for Soldered Electrical and Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2004
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 11/01/2017
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
standard by Association Connecting Electronics Industries, 08/01/1995
An Introduction to Tape Automated Bonding Fine Pitch Technology
standard by Association Connecting Electronics Industries, 01/01/1989
Electronic Design Data Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 08/01/1985
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2002
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
standard by Association Connecting Electronics Industries, 09/01/1988
Guidelines for High Volume Microsection
standard by Association Connecting Electronics Industries, 10/01/1993
2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000