IPC J-STD-001G
Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 10/31/2017
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IPC J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
standard by Association Connecting Electronics Industries, 01/01/2006
IPC D-352
Electronic Design Data Description for Printed Boards in Digital Form
standard by Association Connecting Electronics Industries, 08/01/1985
IPC J-STD-002E
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 11/01/2017
IPC DD-135
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
standard by Association Connecting Electronics Industries, 08/01/1995
IPC SMC-TR-001
An Introduction to Tape Automated Bonding Fine Pitch Technology
standard by Association Connecting Electronics Industries, 01/01/1989
IPC TR-579
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
standard by Association Connecting Electronics Industries, 09/01/1988
IPC MS-810
Guidelines for High Volume Microsection
standard by Association Connecting Electronics Industries, 10/01/1993
IPC HDBK-830
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2002
IPC TMRC-00T
2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000