IPC J-STD-609A
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes
standard by Association Connecting Electronics Industries, 03/01/2010
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IPC MB-380
Guidelines for Molded Interconnection Devices
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/1990
IPC MI-660
Guidelines for Incoming Inspection of Printed Board Material
standard by Association Connecting Electronics Industries,
IPC QE-615
Electronic Assembly Evaluation Handbook
standard by Association Connecting Electronics Industries,
IPC TR-484
Results of IPC Copper Foil Ductility Round Robin Study
standard by Association Connecting Electronics Industries, 04/01/1986
IPC TR-551
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
standard by Association Connecting Electronics Industries, 07/01/1993
IPC TR-461
Solderability Evaluation of Thick and Thin Fused Coatings
standard by Association Connecting Electronics Industries, 03/01/1979