JEDEC JEP149
APPLICATION THERMAL DERATING METHODOLOGIES
standard by JEDEC Solid State Technology Association, 11/01/2004
APPLICATION THERMAL DERATING METHODOLOGIES
standard by JEDEC Solid State Technology Association, 11/01/2004
STANDARD DATA TRANSFER FORMAT BETWEEN DATA PREPARATION SYSTEM AND PROGRAMMABLE LOGIC DEVICE PROGRAMMER
standard by JEDEC Solid State Technology Association, 06/01/1994
Thermal Test Chip Guideline (Wire Bond Type Chip)
standard by JEDEC Solid State Technology Association, 06/01/2019
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS
standard by JEDEC Solid State Technology Association, 11/01/1999
STANDARD FOR DESCRIPTION OF LOW-VOLTAGE TTL-COMPATIBLE BiCMOS LOGIC DEVICES
standard by JEDEC Solid State Technology Association, 05/01/1996
Low Power Double Data Rate 3 SDRAM (LPDDR3)
standard by JEDEC Solid State Technology Association, 05/01/2012
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014
2.5 V BiCMOS LOGIC DEVICE FAMILY SPECIFICATION WITH 5 V TOLERANT INPUTS AND OUTPUTS
standard by JEDEC Solid State Technology Association, 06/01/1999
METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995
HIGH TEMPERATURE STORAGE LIFE
standard by JEDEC Solid State Technology Association, 11/01/2004