JEDEC JESD22-B110B.01
Mechanical Shock – Device and Subassembly
standard by JEDEC Solid State Technology Association, 06/01/2019
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JEDEC JEP149
APPLICATION THERMAL DERATING METHODOLOGIES
standard by JEDEC Solid State Technology Association, 11/01/2004
JEDEC JESD3-C
STANDARD DATA TRANSFER FORMAT BETWEEN DATA PREPARATION SYSTEM AND PROGRAMMABLE LOGIC DEVICE PROGRAMMER
standard by JEDEC Solid State Technology Association, 06/01/1994
JEDEC JESD51-4A
Thermal Test Chip Guideline (Wire Bond Type Chip)
standard by JEDEC Solid State Technology Association, 06/01/2019
JEDEC JESD75
BALL GRID ARRAY PINOUTS STANDARDIZED FOR 32-BIT LOGIC FUNCTIONS
standard by JEDEC Solid State Technology Association, 11/01/1999
JEDEC JESD31D
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 09/01/2010
JEDEC JEP155A.01
RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2012
JEDEC JEP153A
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
standard by JEDEC Solid State Technology Association, 03/01/2014
JEDEC JESD70
2.5 V BiCMOS LOGIC DEVICE FAMILY SPECIFICATION WITH 5 V TOLERANT INPUTS AND OUTPUTS
standard by JEDEC Solid State Technology Association, 06/01/1999