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JEDEC JESD51-5

EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS
standard by JEDEC Solid State Technology Association, 02/01/1999

JEDEC JESD79-3-1A

Addendum No. 1 to JESD79-3 – 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
Amendment by JEDEC Solid State Technology Association, 01/01/2013

JEDEC JESD8-18A

FBDIMM SPECIFICATION: HIGH SPEED DIFFERENTIAL PTP LINK AT 1.5 V
standard by JEDEC Solid State Technology Association, 03/01/2008

JEDEC JESD213

STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) – LEAD (Pb) CONTENT
standard by JEDEC Solid State Technology Association, 03/01/2010

JEDEC JESD51-9

TEST BOARDS FOR AREA ARRAY SURFACE MOUNT PACKAGE THERMAL MEASUREMENTS
standard by JEDEC Solid State Technology Association, 07/01/2000

JEDEC JESD237

Reliability Qualification of Power Amplifier Modules
standard by JEDEC Solid State Technology Association, 03/01/2014