JEDEC JESD22-A108D
TEMPERATURE, BIAS, AND OPERATING LIFE
standard by JEDEC Solid State Technology Association, 11/01/2010
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JEDEC JESD16-A (R2008)
ASSESSMENT OF AVERAGE OUTGOING QUALITY LEVELS IN PARTS PER MILLION (PPM)
standard by JEDEC Solid State Technology Association, 04/01/1995
JEDEC JESD96A-1
Addendum 1 to JESD96A – INTEROPERABILITY AND COMPLIANCE TECHNICAL REQUIREMENTS FOR JEDEC STANDARD JESD96A – RECOMMENDED PRACTICE FOR USE WITH IEEE 802.11N
Amendment by JEDEC Solid State Technology Association, 01/01/2007
JEDEC JESD82-6A
DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 11/01/2004
JEDEC JESD82-3B
DEFINITION OF THE SSTV16857 2.5 V, 14-BIT SSTL_2 REGISTERED BUFFER FOR DDR DIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 11/01/2004
JEDEC JESD22-A113G
PRECONDITIONING OF PLASTIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
standard by JEDEC Solid State Technology Association, 10/01/2015
JEDEC JS 9702
IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
standard by JEDEC Solid State Technology Association, 06/01/2004
JEDEC JESD284-A (R2002)
TEST METHODS FOR THE COLLECTOR-BASE TIME CONSTANT AND FOR THE RESISTIVE PART OF THE COMMON-EMITTER INPUT IMPEDANCE
standard by JEDEC Solid State Technology Association, 11/01/1963
JEDEC JESD214.01
CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 08/01/2017