JEDEC JEP172
DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2014
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JEDEC JEP140 (R2006)
BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
standard by JEDEC Solid State Technology Association, 06/01/2002
JEDEC JESD8-14A.01
1.0 V +/- 0.1 V (NORMAL RANGE) AND 0.7 V – 1.1 V (WIDE RANGE) POWER SUPPLY VOLTAGE AND INTERFACE STANDARD FOR NONTERMINATED DIGITAL INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 09/01/2007
JEDEC JESD659B
FAILURE-MECHANISM-DRIVEN RELIABILITY MONITORING
standard by JEDEC Solid State Technology Association, 02/01/2007
JEDEC J-STD-033D
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
standard by JEDEC Solid State Technology Association, 04/01/2018
JEDEC JESD 22-B105C (R2006)
LEAD INTEGRITY
standard by JEDEC Solid State Technology Association, 05/01/2003
JEDEC JESD 12-6
ADDENDUM No. 6 to JESD12 – INTERFACE STANDARD FOR SEMICUSTOM INTEGRATED CIRCUITS
Amendment by JEDEC Solid State Technology Association, 03/01/1991
JEDEC JESD22-B117A
SOLDER BALL SHEAR
standard by JEDEC Solid State Technology Association, 10/01/2006
JEDEC JESD22-A119A
LOW TEMPERATURE STORAGE LIFE
standard by JEDEC Solid State Technology Association, 10/01/2015
JEDEC JESD9C
Inspection Criteria for Microelectronic Packages and Covers
standard by JEDEC Solid State Technology Association, 05/01/2017