JEDEC J-STD-033D
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
standard by JEDEC Solid State Technology Association, 04/01/2018
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
standard by JEDEC Solid State Technology Association, 04/01/2018
LEAD INTEGRITY
standard by JEDEC Solid State Technology Association, 05/01/2003
ADDENDUM No. 6 to JESD12 – INTERFACE STANDARD FOR SEMICUSTOM INTEGRATED CIRCUITS
Amendment by JEDEC Solid State Technology Association, 03/01/1991
SOLDER BALL SHEAR
standard by JEDEC Solid State Technology Association, 10/01/2006
LOW TEMPERATURE STORAGE LIFE
standard by JEDEC Solid State Technology Association, 10/01/2015
Inspection Criteria for Microelectronic Packages and Covers
standard by JEDEC Solid State Technology Association, 05/01/2017
POD18 – 1.8 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 12/01/2006
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
standard by JEDEC Solid State Technology Association, 03/01/2010
DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2014
BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
standard by JEDEC Solid State Technology Association, 06/01/2002