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JEDEC JESD 35-2

ADDENDUM No. 2 to JESD35 – TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 02/01/1996

JEDEC JEP167

Characterization of Interfacial Adhesion in Semiconductor Packages
standard by JEDEC Solid State Technology Association, 04/01/2013

JEDEC JESD205

FBDIMM STANDARD: DDR2 SDRAM FULLY BUFFERED DIMM (FBDIMM) DESIGN SPECIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2007

JEDEC JEP154

GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
standard by JEDEC Solid State Technology Association, 01/01/2008

JEDEC JESD217

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
standard by JEDEC Solid State Technology Association, 09/01/2010

JEDEC JESD209-4-1

Addendum No. 1 to JESD209-4 – Low Power Double Data Rate 4 (LPDDR4)
Amendment by JEDEC Solid State Technology Association, 01/01/2017

JEDEC JESD 12-2

ADDENDUM No. 2 to JESD12 – STANDARD FOR CELL-BASED INTEGRATED CIRCUIT BENCHMARK SET
Amendment by JEDEC Solid State Technology Association, 02/01/1986