JEDEC JESD 35-2
ADDENDUM No. 2 to JESD35 – TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 02/01/1996
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JEDEC JEP167
Characterization of Interfacial Adhesion in Semiconductor Packages
standard by JEDEC Solid State Technology Association, 04/01/2013
JEDEC JESD205
FBDIMM STANDARD: DDR2 SDRAM FULLY BUFFERED DIMM (FBDIMM) DESIGN SPECIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2007
JEDEC JESD217
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
standard by JEDEC Solid State Technology Association, 09/01/2010
JEDEC JEP154
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
standard by JEDEC Solid State Technology Association, 01/01/2008
JEDEC JESD 471 (R2009)
SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES
standard by JEDEC Solid State Technology Association,
JEDEC JEP118
GUIDELINES FOR GaAs MMIC AND FET LIFE TESTING
standard by JEDEC Solid State Technology Association, 12/01/2018
JEDEC JESD 22-B107C
MARKING PERMANENCY
standard by JEDEC Solid State Technology Association, 09/01/2004
JEDEC JESD209-4-1
Addendum No. 1 to JESD209-4 – Low Power Double Data Rate 4 (LPDDR4)
Amendment by JEDEC Solid State Technology Association, 01/01/2017