JEDEC JEP167
Characterization of Interfacial Adhesion in Semiconductor Packages
standard by JEDEC Solid State Technology Association, 04/01/2013
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JEDEC JESD205
FBDIMM STANDARD: DDR2 SDRAM FULLY BUFFERED DIMM (FBDIMM) DESIGN SPECIFICATION
standard by JEDEC Solid State Technology Association, 03/01/2007
JEDEC JEB 5-A (R1984)
METHODS OF MEASUREMENT FOR SEMICONDUCTOR LOGIC GATING MICROCIRCUITS
standard by JEDEC Solid State Technology Association, 01/01/1970
JEDEC JEP154
GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
standard by JEDEC Solid State Technology Association, 01/01/2008
JEDEC JESD217
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
standard by JEDEC Solid State Technology Association, 09/01/2010
JEDEC JESD22-B104C (R2009)
MECHANICAL SHOCK
standard by JEDEC Solid State Technology Association, 11/01/2004
JEDEC JEP170
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
standard by JEDEC Solid State Technology Association, 01/01/2013
JEDEC JESD 35-1
ADDENDUM No. 1 to JESD35 – GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 09/01/1995
JEDEC JESD 471 (R2009)
SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES
standard by JEDEC Solid State Technology Association,