JEDEC JEP172
DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2014
DISCONTINUING USE OF THE MACHINE MODEL FOR DEVICE ESD QUALIFICATION
standard by JEDEC Solid State Technology Association, 07/01/2014
BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
standard by JEDEC Solid State Technology Association, 06/01/2002
TEMPERATURE CYCLING
standard by JEDEC Solid State Technology Association, 03/01/2009
LOW POWER DOUBLE DATA RATE (LPDDR) SDRAM STANDARD
standard by JEDEC Solid State Technology Association, 02/01/2010
METHOD OF DIODE Q MEASUREMENT
standard by JEDEC Solid State Technology Association, 11/01/1981
FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 03/01/2009
LOW TEMPERATURE STORAGE LIFE
standard by JEDEC Solid State Technology Association, 11/01/2004
RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
standard by JEDEC Solid State Technology Association, 04/01/2008
ADDENDUM No. 3 to JESD24 – THERMAL IMPEDANCE MEASUREMENTS FOR VERTICAL POWER MOSFETS (DELTA SOURCE-DRAIN VOLTAGE METHOD)
Amendment by JEDEC Solid State Technology Association, 11/01/1990
POD125 – 1.25 V Pseudo Open Drain I/O
standard by JEDEC Solid State Technology Association, 06/01/2019