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JEDEC JESD213A

STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) – LEAD (Pb) CONTENT
standard by JEDEC Solid State Technology Association, 04/01/2017

JEDEC JEP130B

GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING (TUBES, TRAYS, AND TAPE AND REEL)
standard by JEDEC Solid State Technology Association, 11/01/2016

JEDEC JESD 82-25

DEFINITION OF the SSTUB32866 1.8 V CONFIGURABLE REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007

JEDEC JEP139

GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
standard by JEDEC Solid State Technology Association, 12/01/2000

JEDEC JEP 148A

RELIABILITY QUALIFICATION OF SEMICONDUCTOR DEVICES BASED ON PHYSICS OF FAILURE RISK AND OPPORTUNITY ASSESSMENT
standard by JEDEC Solid State Technology Association, 12/01/2008

JEDEC JESD51-52

Guidelines for Combining CIE 127-2007 Total Flux Measurements with Thermal Measurements of LEDs with Exposed Cooling Surface
standard by JEDEC Solid State Technology Association, 04/01/2012