JEDEC JEP170
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
standard by JEDEC Solid State Technology Association, 01/01/2013
Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
standard by JEDEC Solid State Technology Association, 01/01/2013
ADDENDUM No. 1 to JESD35 – GENERAL GUIDELINES FOR DESIGNING TEST STRUCTURES FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
standard by JEDEC Solid State Technology Association, 09/01/1995
SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES
standard by JEDEC Solid State Technology Association,
GUIDELINES FOR GaAs MMIC AND FET LIFE TESTING
standard by JEDEC Solid State Technology Association, 12/01/2018
Potential Failure Mode and Effects Analysis (FMEA)
standard by JEDEC Solid State Technology Association, 08/01/2018
DESIGNATION SYSTEM FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 02/01/1982
WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 04/01/2017
RECOMMENDED PRACTICE FOR MEASUREMENT OF TRANSISTOR LEAD TEMPERATURE
standard by JEDEC Solid State Technology Association, 06/01/2004
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
standard by JEDEC Solid State Technology Association, 04/01/2010