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JEDEC JP 002

CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
standard by JEDEC Solid State Technology Association, 03/01/2006

JEDEC JESD51-32

THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
standard by JEDEC Solid State Technology Association, 12/01/2010

JEDEC JESD90

A PROCEDURE FOR MEASURING P-CHANNEL MOSFET NEGATIVE BIAS TEMPERATURE INSTABILITIES
standard by JEDEC Solid State Technology Association, 11/01/2004

JEDEC JESD51-50

Overview of Methodologies for the Thermal Measurement of Single- and Multi-Chip, Single- and Multi-PN-Junction Light-Emotting Diodes (LEDs)
standard by JEDEC Solid State Technology Association, 04/18/2012

JEDEC JESD82-19A

DEFINITION OF THE SSTUA32S865 AND SSTUA32D865 28-BIT 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007

JEDEC JESD51-3

LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1996

JEDEC JESD7-A

STANDARD FOR DESCRIPTION OF 54/74HCXXXX AND 54/74HCTXXXX HIGH SPEED CMOS DEVICES
standard by JEDEC Solid State Technology Association, 08/01/1986