JEDEC JESD84-B41
MULTIMEDIACARD (MMC) ELECTRICAL STANDARD, STANDARD CAPACITY (MMCA, 4.1)
standard by JEDEC Solid State Technology Association, 06/01/2007
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JEDEC JESD22-B109A
FLIP CHIP TENSILE PULL
standard by JEDEC Solid State Technology Association, 01/01/2009
JEDEC JP 002
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
standard by JEDEC Solid State Technology Association, 03/01/2006
JEDEC JESD51-32
THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
standard by JEDEC Solid State Technology Association, 12/01/2010
JEDEC JESD230A
NAND Flash Interface Interoperability
standard by JEDEC Solid State Technology Association, 10/01/2012
JEDEC JESD51-3
LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1996
JEDEC JESD7-A
STANDARD FOR DESCRIPTION OF 54/74HCXXXX AND 54/74HCTXXXX HIGH SPEED CMOS DEVICES
standard by JEDEC Solid State Technology Association, 08/01/1986
JEDEC JESD22-A102C (R2008)
ACCELERATED MOISTURE RESISTANCE – UNBIASED AUTOCLAVE
standard by JEDEC Solid State Technology Association, 12/01/2000
JEDEC JESD82-19A
DEFINITION OF THE SSTUA32S865 AND SSTUA32D865 28-BIT 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 05/01/2007
JEDEC JESD82-17
DEFINITION OF THE SSTUA32S868 AND SSTUA32D868 REGISTERED BUFFER WITH PARITY FOR 2R X 4 DDR2 RDIMM APPLICATIONS
standard by JEDEC Solid State Technology Association, 11/01/2005