JEDEC JESD22-B116B
WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 04/01/2017
WIRE BOND SHEAR TEST
standard by JEDEC Solid State Technology Association, 04/01/2017
Guide to Standards and Publications Relating to Quality and Reliability of Electronic Hardware
standard by JEDEC Solid State Technology Association, 10/01/2013
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
standard by JEDEC Solid State Technology Association, 10/01/2006
JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SOLID STATE SURFACE-MOUNT DEVICES
standard by JEDEC Solid State Technology Association, 12/01/2014
FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2010
ACCELERATED MOISTURE RESISTANCE – UNBIASED HAST
standard by JEDEC Solid State Technology Association, 07/01/2015
ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
standard by JEDEC Solid State Technology Association, 11/01/2018
ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY TESTING MACHINE MODEL (MM)
standard by JEDEC Solid State Technology Association, 11/01/2010
RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION
standard by JEDEC Solid State Technology Association, 08/01/2008
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
standard by JEDEC Solid State Technology Association, 03/01/2006