JEDEC JESD22-A113H
PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
standard by JEDEC Solid State Technology Association, 11/01/2016
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JEDEC JESD 27
CERAMIC PACKAGE SPECIFICATION FOR MICROELECTRONIC PACKAGES
standard by JEDEC Solid State Technology Association, 08/01/1993
JEDEC JEP158
3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
standard by JEDEC Solid State Technology Association, 11/01/2009
JEDEC JESD 31C
GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 09/01/2003
JEDEC JESD51-1
INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD – ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995
JEDEC JESD22-A111A
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2010
JEDEC JESD209-4B
Low Power Double Data Rate 4 (LPDDR4)
standard by JEDEC Solid State Technology Association, 02/01/2017
JEDEC JEP 106AA
STANDARD MANUFACTURERS IDENTIFICATION CODE
standard by JEDEC Solid State Technology Association, 04/01/2009
JEDEC JESD51-8
INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – JUNCTION-TO-BOARD
standard by JEDEC Solid State Technology Association, 10/01/1999
JEDEC JESD 321-C (R2009)
NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 02/01/1987