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JEDEC JESD22-A113H

PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
standard by JEDEC Solid State Technology Association, 11/01/2016

JEDEC JESD51-1

INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD – ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)
standard by JEDEC Solid State Technology Association, 12/01/1995

JEDEC JEP158

3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
standard by JEDEC Solid State Technology Association, 11/01/2009

JEDEC JESD 31C

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 09/01/2003

JEDEC JESD22-A111A

EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
standard by JEDEC Solid State Technology Association, 11/01/2010

JEDEC JESD51-8

INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS – JUNCTION-TO-BOARD
standard by JEDEC Solid State Technology Association, 10/01/1999

JEDEC JESD 321-C (R2009)

NUMBERING OF LIKE-NAMED TERMINAL FUNCTIONS IN SEMICONDUCTOR DEVICES AND DESIGNATION OF UNITS IN MULTIPLE-UNIT SEMICONDUCTOR DEVICES
standard by JEDEC Solid State Technology Association, 02/01/1987