Side Navigation

X

ASTM Volume 10.04:2021

Click here to purchase
Published annually in April.

This volume contains 147 standards.

Subjects cover:

  • Innerlayer Interconnections and Bonding
  • Materials and Processes for Vacuum Tubes
  • Electronic Device Characterization
  • Hermetic Seals
  • Hybrid Circuits and Substrates
  • Microelectronic Packaging
  • Leak Testing
  • and more
    This volume also includes the latest standards relating to

  • Declarable substances in materials
  • 3D imaging systems
  • Additive manufacturing technologies

Product Details

Published:
04/01/2021
ISBN(s):
9781682217696
Number of Pages:
1274

You May Also Like