IEC 60749-15 Ed. 3.0 b:2020

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IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.

Product Details

Edition:

3.0

Published:

07/14/2020

Number of Pages:

17

File Size:

1 file , 1000 KB