IEC 61188-6-2 Ed. 1.0 b:2021

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IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.

Product Details

Edition:

1.0

Published:

02/04/2021

Number of Pages:

49

File Size:

1 file , 2.1 MB