IEC 62137-1-2 Ed. 1.0 b:2007

Click here to purchase
The test method described in IEC 62137-1-2:2007 is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.

Product Details

Edition:

1.0

Published:

07/25/2007

Number of Pages:

33

File Size:

1 file , 1000 KB