IEC 62899-202-9 Ed. 1.0 en:2023

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This part of IEC 62899 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

Product Details

Edition:

1.0

Published:

08/01/2023

ISBN(s):

9782832273289

Number of Pages:

18

File Size:

1 file , 670 KB

Note:

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