IEC 63011-1 Ed. 1.0 b:2018

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IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Product Details

Edition:

1.0

Published:

11/28/2018

Number of Pages:

24

File Size:

1 file , 1.3 MB