IPC 7525

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This new document provides guides for the design and fabrication of stencils for solder paste andsurface-mount adhesive. This is the first time this important information has been collected andpublished in an industry consensus document. Stencil design for various surface-mounttechnology, as well as mixed technology with through-hole or flip chip components is discussed;this includes overprint, two-print and step stencil designs. A sample order form and a userinspection checklist are also included.

Product Details

Published:

05/01/2000

Number of Pages:

20

File Size:

1 file , 330 KB

Product Code(s):

7525(D)1