IPC 9701

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Provides specific test methods used in the establishment of levels of performance and reliability for surface mount solder attachments of electronic assemblies. In addition to an understanding of the physics of surface mount solder joint failure, this document also provides an approximate means of relating the results from the performance test methods included to the reliability of solder attachments for the use environments and conditions of electronic assemblies.

Product Details

Published:

01/01/2002

Number of Pages:

22

File Size:

1 file , 300 KB

Product Code(s):

9701(D)1, 9701(D)1