IPC CM-770E
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Demonstrates effective guidelines in the preparation of components for assembly of printed wiring boards and reviews pertinent design criteria, impacts and issues. Contains techniques for assembly (both manual and machines including SMT and flip chip) and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes.
Product Details
- Published:
- 01/01/2004
- File Size:
- 1 file , 2.3 MB