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IPC J-STD-027

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THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Product Details

Published:
02/01/2003
Number of Pages:
20
File Size:
1 file , 90 KB
Product Code(s):
J-027(D)1, J-027(D)1

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