IPC J-STD-027
Click here to purchase
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Product Details
- Published:
- 02/01/2003
- Number of Pages:
- 20
- File Size:
- 1 file , 90 KB
- Product Code(s):
- J-027(D)1, J-027(D)1