JEDEC JESD22-B118

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This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.

Product Details

Published:

03/01/2011

Number of Pages:

18

File Size:

1 file , 770 KB